1. 2. 3. material content data sheet sales product name tle75004-eld issued 28. september 2015 ma# ma001400756 package pg-ssop-14-8 weight* 83.06 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.099 1.32 1.32 13231 13231 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 104 non noble metal zinc 7440-66-6 0.034 0.04 415 non noble metal iron 7439-89-6 0.689 0.83 8296 non noble metal copper 7440-50-8 27.978 33.68 34.56 336849 345664 wire non noble metal copper 7440-50-8 0.446 0.54 0.54 5374 5374 encapsulation organic material carbon black 1333-86-4 0.101 0.12 1217 plastics epoxy resin - 4.648 5.60 55963 inorganic material silicondioxide 60676-86-0 45.774 55.12 60.84 551118 608298 leadfinish non noble metal tin 7440-31-5 0.988 1.19 1.19 11899 11899 plating noble metal silver 7440-22-4 0.768 0.92 0.92 9242 9242 glue plastics epoxy resin - 0.131 0.16 1573 noble metal silver 7440-22-4 0.392 0.47 0.63 4719 6292 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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